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Alfa Aesar™ Copper Thinfoil, Oxygen-Free High Conductivity (OFHC), 0.008mm (0.0003 in.) thick, 99.99% (metals basis)

372.00 DKK - 3185.00 DKK

Chemical Identifiers

CAS 7440-50-8
Molecular Formula Cu
Molecular Weight (g/mol) 63.546
MDL Number MFCD00010965
InChI Key RYGMFSIKBFXOCR-UHFFFAOYSA-N
Synonym cuprum, cobre, cuivre, blister, cathode, bronze, powder, anode, precipitates, kupfer
PubChem CID 23978
ChEBI CHEBI:30052
IUPAC Name copper
SMILES [Cu]
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Products 3
Product Code Brand Quantity Price Quantity & Availability  
Product Code Brand Quantity Price Quantity & Availability  
15475005
SDS View Documents
Alfa Aesar™
045943.FF
25 x 25mm
372.00 DKK
Each
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Estimated Shipment
30-03-2021
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15485005
SDS View Documents
Alfa Aesar™
045943.FI
50 x 50mm
912.00 DKK
Each
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15495005
SDS View Documents
Alfa Aesar™
045943.GH
100 x 100mm
3185.00 DKK
Each
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Estimated Shipment
30-03-2021
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Description

Description

Specifications

Chemical Identifiers

7440-50-8
63.546
RYGMFSIKBFXOCR-UHFFFAOYSA-N
23978
copper
Cu
MFCD00010965
cuprum, cobre, cuivre, blister, cathode, bronze, powder, anode, precipitates, kupfer
CHEBI:30052
[Cu]

Specifications

Copper Thinfoil
25 x 25mm
7440-50-8
Cu
cuprum, cobre, cuivre, blister, cathode, bronze, powder, anode, precipitates, kupfer
[Cu]
Odorless
23978
Thin Foil, ≈0.04g/25x25mm
≈0.04g/25x25mm
Oxygen-Free High Conductivity (OFHC), 0.008mm (0.0003 in.) thick
(metals basis)
MFCD00010965
RYGMFSIKBFXOCR-UHFFFAOYSA-N
copper
63.546
CHEBI:30052
99.99%
SDS